About us

Xinzhou Integrated Circuit (Shanghai) Co., Ltd. is a professional SiP system level packaging solution development platform that provides one-stop services and solutions for high-tech microelectronics enterprises and their partners, including SiP chip design, SiP packaging design simulation, SiP internal wafer procurement, SIP packaging production, SIP packaging system level testing, SIP packaging reliability and failure analysis, focusing on the field of semiconductor integrated circuits/optical advanced packaging, Build a research and development platform to assist domestic microelectronic system companies in completing SiP chip customization, reduce the threshold for chip customization, lower the initial investment cost of chip customization, and shorten the chip customization cycle. Xinzhou Integrated Circuit (Shanghai) Co., Ltd. has cooperated with several well-known domestic packaging factories to provide customers with advanced packaging and testing equipment in the industry. It has the ability to provide process services such as wafer testing, thinning and cutting, chip and device mounting, plastic packaging, marking, ball planting, electromagnetic shielding, cutting, reliability testing, failure analysis, functional testing, packaging, etc, Equipped with high-precision surface mounting capabilities for ultra-thin passive components and multiple heterogeneous chips, it can be used for advanced packaging of complex high-density mounting surfaces, with full process capabilities including Spitter EMI electromagnetic shielding technology. The technology platform focuses on using FC SiP/FC+WB SiP/SiP modules/Stack Die SiP. FCFLGA/fcFBGA/fcPoP/SiP/LGA/FBGA is a system level advanced packaging process that provides partial/complete combination of customized system level one-stop packaging and testing services for MEMS, ASIC, microprocessor, storage, power management, wireless communication and other chips involved in various products.