After the bare chip undergoes different packaging processes to become packaged devices and modules, it needs to be tested, which is commonly referred to as "Final Test, FT" or "Package Test". In terms of the boundary requirements for circuit characteristics, FT testing usually follows stricter standards than CP testing. The device may undergo multiple tests under multiple sets of temperature conditions to ensure that temperature sensitive characteristic parameters are normal. The following figure is a schematic diagram of FT:
This public service platform can provide both laboratory level testing services and mass production level testing services. Among them, laboratory level testing services are suitable for the early stage of product development, and testing is relatively flexible. The current laboratory testing capabilities are shown in the table below:
