Reliability testing is usually used to test whether packaged devices or modules can ensure reliable operation during subsequent service processes. Provide device level reliability testing items as follows:
After reliability testing or during the later service process, product failure requires the use of failure analysis methods to find the cause and improve the process. Failure analysis should follow the principle of non-destructive analysis before destructive analysis, and trace the cause of failure as comprehensively as possible. The relevant failure analysis equipment and capabilities currently configured on this public service platform are as follows:
The electrical performance analysis is configured with surface multimeter, oscilloscope, signal source, resistance tester, LCR tester, spectrum analyzer, network analyzer, wireless comprehensive tester and other equipment, which can preliminarily locate the failure point;
Internal structure analysis (non-destructive analysis) is equipped with 3D X-ray and ultrasonic scanning microscope, which can observe internal holes, broken lines, delamination, bubbles, cracks and other failures without damaging the product structure;
Microscopic morphology analysis is equipped with equipment such as optical microscopy, infrared microscopy, scanning electron microscopy, etc. for observation of defects or microscopic morphology, composition analysis, etc.
